Packaging of High Power Semiconductor

¥11375

(税込) 送料込み

16
コメント

商品の説明

Packaging of High Power Semiconductor Lasers

(Micro- and Opto-Electronic Materials, Structures, and Systems) (English Edition)

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

ISBN-13: 978-1461492627

高出力半導体レーザーの実装について
素子構造、ビーム整形、モジュール化、素子の評価装置などについての専門書

家庭内保管、ざっと見ましたが書き込みはありません。

商品の情報

カテゴリー本・音楽・ゲーム > 本 > 参考書
商品の状態目立った傷や汚れなし
11375円Packaging of High Power Semiconductor本・音楽・ゲーム本Trends in Power Electronics Packaging
Advanced power electronics packaging - Power Electronic Tips

Advanced power electronics packaging - Power Electronic Tips


Packaging of High Power Semiconductor Lasers

Packaging of High Power Semiconductor Lasers


Power Packaging | High Density Electronics Center

Power Packaging | High Density Electronics Center


It's Time to Rethink Power Semiconductor Packaging

It's Time to Rethink Power Semiconductor Packaging


Power Electronics Packaging and Assembly | Indium Corporation

Power Electronics Packaging and Assembly | Indium Corporation


Increasing The Conductive Density Of Packaging

Increasing The Conductive Density Of Packaging


Power Electronics Packaging | Transportation and Mobility Research

Power Electronics Packaging | Transportation and Mobility Research


High temperature power electronic module packaging | Semantic Scholar

High temperature power electronic module packaging | Semantic Scholar


Advanced power electronics packaging - Power Electronic Tips

Advanced power electronics packaging - Power Electronic Tips


Power electronics packaging concepts: (a) the planar structure

Power electronics packaging concepts: (a) the planar structure


Thermal High-Performance Packaging - CITC - One of the program lines

Thermal High-Performance Packaging - CITC - One of the program lines


Trends in automotive power semiconductor packaging - ScienceDirect

Trends in automotive power semiconductor packaging - ScienceDirect


Power Electronics Packaging | Transportation and Mobility Research

Power Electronics Packaging | Transportation and Mobility Research


Advanced power electronics packaging - Power Electronic Tips

Advanced power electronics packaging - Power Electronic Tips


Figure 1 from Survey on High-Temperature Packaging Materials for

Figure 1 from Survey on High-Temperature Packaging Materials for


Frontiers | Review of Issues and Solutions in High-Power

Frontiers | Review of Issues and Solutions in High-Power


Energies | Free Full-Text | High Performance Silicon Carbide Power

Energies | Free Full-Text | High Performance Silicon Carbide Power


Trends in packaging of high power semiconductor laser bars - UNT

Trends in packaging of high power semiconductor laser bars - UNT


Six Reasons to Rethink Power Semiconductor Packaging

Six Reasons to Rethink Power Semiconductor Packaging


Trends in automotive power semiconductor packaging - ScienceDirect

Trends in automotive power semiconductor packaging - ScienceDirect


Power devices market evolution and related technical developments

Power devices market evolution and related technical developments


Powerful Knowledge 11 - Packaging of power semiconductors

Powerful Knowledge 11 - Packaging of power semiconductors


Trends in Power Electronics Packaging

Trends in Power Electronics Packaging


Power Device Package Designs - Power Electronics News

Power Device Package Designs - Power Electronics News


Technology Trends & Challenges in Power Semiconductor Packaging

Technology Trends & Challenges in Power Semiconductor Packaging


Power Semiconductor Device and Packaging (PSDP) | SPEC | The

Power Semiconductor Device and Packaging (PSDP) | SPEC | The


IMAPS | APEC | GOMACTech

IMAPS | APEC | GOMACTech


Energies | Free Full-Text | High Performance Silicon Carbide Power

Energies | Free Full-Text | High Performance Silicon Carbide Power


Packaging - Aalborg University

Packaging - Aalborg University


Six Reasons to Rethink Power Semiconductor Packaging

Six Reasons to Rethink Power Semiconductor Packaging


Study on Thermal Stress of High Power Semiconductor Laser

Study on Thermal Stress of High Power Semiconductor Laser


An OSAT Perspective On Semiconductor Market Trends

An OSAT Perspective On Semiconductor Market Trends


Review of Issues and Solutions in High-Power Semiconductor Laser

Review of Issues and Solutions in High-Power Semiconductor Laser


Packaging Advances High-Power White LEDs | Features | Aug 2005

Packaging Advances High-Power White LEDs | Features | Aug 2005


Power Packaging for Automotive Semiconductors – Now and Future

Power Packaging for Automotive Semiconductors – Now and Future


Study on thermal stress of high power semiconductor laser

Study on thermal stress of high power semiconductor laser


Yole Group - Follow the latest trend news in the Semiconductor

Yole Group - Follow the latest trend news in the Semiconductor


Infineon QDPAK and DDPAK registered as JEDEC standard - News

Infineon QDPAK and DDPAK registered as JEDEC standard - News


PDF) Review of Packaging Schemes for Power Module

PDF) Review of Packaging Schemes for Power Module


Advanced Semiconductor Packaging 2023-2033: IDTechEx

Advanced Semiconductor Packaging 2023-2033: IDTechEx







もっと見る

商品の情報

カテゴリー
配送料の負担
送料込み(出品者負担)
配送の方法
ゆうゆうメルカリ便
郵便局/コンビニ受取匿名配送
発送元の地域
宮城県
発送までの日数
1~2日で発送

メルカリ安心への取り組み

お金は事務局に支払われ、評価後に振り込まれます

出品者

スピード発送

この出品者は平均24時間以内に発送しています

Packaging of High Power Semiconductor

この商品を見ている人におすすめ